Project Awards

Project Title Award Date Project Value
Lead-Free Project 01/20/2021 $1,462,189.00
Defense Business Accelerator (DBX) 09/08/2023 $10,798,670.00
PCB Market Catalyst (NewCo) 09/08/2023 $754,000.00

Award Date: 01/20/2021
Project Title: Lead Free Defense Electronics Project
Project Performers: Purdue University, the University of Maryland, and Auburn University
Award Amount: $1,462,189.00
Overview: This project will foster research and actions to accelerate the transition to lead-free electronics in aerospace, defense, and other high-performance electronics. Materials applied at the microscopic level on commonly used subcomponents critical to the functions of sophisticated defense systems in diverse, challenging environments throughout – and beyond – the planet. The DEC lead-free team has the deep industry knowledge, innovative research capabilities, and leading-edge facilities required to successfully migrate to lead-free defense electronics.

Award Date: 09/08/2023
Project Title: Defense Business Accelerator (DBX)
Award Amount: $10,798,670.00
Overview: USPAE in partnership with the DoD’s Manufacturing, Capability Expansion, and Investment Prioritization Directorate (MCEIP) will award up to $10 million in funding through a pilot program that will accelerate industrial growth, stimulate private investment, and, most importantly, improve product innovation that benefits both national security and the companies supporting it.

The Defense Business Accelerator (DBX) will be an open solicitation for defense technology proposals that will open doors for more companies of any size to participate. It flips the model of technology development by focusing first on the commercialization of the technology with dual-use for defense needs, rather than concentrating on the defense needs with hopeful commercialization.

Award Date: 09/08/2023
Project Title: Printed Circuit Board (PCB) Market Catalyst
Award Amount: $754,000.00

Overview: The Department of Defense (DoD) has tasked USPAE with studying and recommending an approach to address the country’s lack of manufacturing capability for Ultra High-density Interface (UHDI) and and Integrated Circuit (IC) substrate products. USPAE has already led several workshops attended by industry and government leaders to lay the foundation for this effort. The project kicked off in October and is being fast-tracked to deliver results quickly. Led by industry veteran Joe O’Neil, the project team is just beginning to gather stakeholder input that will help shape the recommendations. Information is needed on current and planned capabilities, projected demand, supply chain challenges and much more.

Past Solicitations

Project Title LATEST STATUS UPDATE SUBMISSION DUE DATE
Electronics Industry Insights RFI The Department of Defense (DoD) seeks to gain insights into the electronics industry that could shape the development of solutions, better inform policy and help establish program priorities. Industry members were invited to contribute to this effort by addressing four topics: Defense Industrial Base, Workforce, Risks & Vulnerabilities, and Industry Data.
Please send an email to info@uspae.org if you would like to respond to this solicitation.		 August 30, 2021